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Introduction

High-level synthesis for low power has attracted significant attention [1,2,3,4,5,6,7,8,9,10,11]. It takes as its input a behavioral description in the form of a control-data flow graph (CDFG) and outputs a power-optimized RTL circuit. Most previous work tried to minimize power consumed by datapath units while ignoring that by interconnects. As shown in [12], interconnects consume a significant fraction of total circuit power. Moreover, since wire delay is becoming more significant, wire buffer insertion has become popular [13]. This in turn has increased the portion of circuit power consumed by interconnects. High-level synthesis can target either bus-based or multiplexer-based interconnections among datapath units [14]. It has a significant impact on the switching activity and topology of the interconnects in the resultant design. To optimize interconnects during high-level synthesis is therefore important. Interconnect cost has been considered in high-level synthesis by many researchers [19,20,21,22,23,24,25]. In most cases, the number of interconnects/multiplexers is used as the interconnect cost. None of these works use physical information to estimate interconnect cost accurately. Moreover, all these works are targeted at only bus-based architectures and only area/performance optimization. For bus-based RTL architectures and system-on-chip (SOC) designs, bus coding has been proposed to reduce switching activity [15,16,17]. The work in [18] proposes to optimize bus power by appropriately binding data transfers to busses. These techniques, however, do not take wire length into consideration, and are not applicable to multiplexer-based interconnects. Taking physical level information into account during high-level synthesis has also attracted a lot of attention [26,27,28,29,30,31,32,33,34,35]. Earlier work used floorplanning information in high-level synthesis to improve design area or performance estimation. Only some recent works took interconnect power consumption into consideration [2,33]. In [33], the switching activity on CDFG edges was profiled. It was used with the floorplanner to optimize the power consumption of inter-module data transfers. Only the floorplanner was made interconnect power-aware. Moreover, the coupling effect between wires was not taken into consideration. In [2], the authors preserved the locality and regularity in input behaviors to optimize bus power consumption in bus-based architectures, though they did not distinguish between busses with different switching activities. Due to the mapping of behavioral identities (operations and variables) to physical identities (functional units and registers), locality and regularity in the behavior does not necessarily guarantee locality in the physical design . In this work, we provide a comprehensive treatment of interconnect-aware high-level synthesis for low power targeting multiplexer-based interconnects. We evaluate the power consumption in the steering logic and clock distribution network as well as data transfer wires, using early floorplanning information. Since coupling capacitances are expected to dominate the wire capacitance in future technologies, we take coupling into account while estimating wire power consumption. Moreover, we propose metrics to guide the binding process to preserve and create locality in the physical implementation. Unlike [2], our methodology does not assume behaviorial locality and regularity. While concentrating on the interconnect power issue, our synthesis flow and methodology maximize the orthogonality to other problems as scheduling, floorplanning, wire and RTL power modeling $etc.$ It is well-known that there can be significant spurious switching activity (SSA), $i.e.$, activity not required by the behavioral specification, in datapath units [36,37,38]. We found that there is significant SSA in interconnects too. It increases the power consumption in the interconnects as well as other circuit components. We propose techniques to suppress it. The paper is organized as follows. We offer our observations and motivational examples in Section II, and discuss RTL interconnect power estimation in Section III. We present methodologies for interconnect-aware binding in Section IV, and address the problem of interconnect SSA in Section V. After giving the framework of our interconnect-aware high-level synthesis system in Section VI, we provide experimental results and conclude in Sections VII and VIII, respectively.
next up previous
Next: Observations and Motivational Examples Up: Interconnect-aware Low Power High-level Previous: Interconnect-aware Low Power High-level
Lin Zhong 2003-10-11